Low Dielectric Constant Materials for IC Applications

Nonfiction, Science & Nature, Technology, Material Science, Electronics
Cover of the book Low Dielectric Constant Materials for IC Applications by , Springer Berlin Heidelberg
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9783642559082
Publisher: Springer Berlin Heidelberg Publication: December 6, 2012
Imprint: Springer Language: English
Author:
ISBN: 9783642559082
Publisher: Springer Berlin Heidelberg
Publication: December 6, 2012
Imprint: Springer
Language: English

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

More books from Springer Berlin Heidelberg

Cover of the book Sensing the Environment: Regulation of Local and Global Homeostasis by the Skin's Neuroendocrine System by
Cover of the book Colposcopy in Diagnosis and Treatment of Preneoplastic Lesions by
Cover of the book Strategie- und Change-Kompetenz für Leitende Ärzte by
Cover of the book Integrative Production Technology for High-Wage Countries by
Cover of the book Carbohydrate Metabolism in Pregnancy and the Newborn 1978 by
Cover of the book Nachhaltiges Facility Management by
Cover of the book Chiral Recognition in Separation Methods by
Cover of the book Community Structure of Complex Networks by
Cover of the book Schmerztherapeutische Injektionstechniken in der Manuellen Therapie by
Cover of the book Modernes Immobilienmanagement by
Cover of the book Springer Handbook of Geographic Information by
Cover of the book Mathematik der Information by
Cover of the book Doing Business in India by
Cover of the book Microfluidics by
Cover of the book Prehistoric Human Bone by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy